KOSINOVA, A.; STRAUMAL, B.; RABKIN, E. Wetting of grain boundaries in ultrafine-grained copper by liquid bismuth. Diffusion Fundamentals, [S. l.], v. 30, 2017. DOI: 10.62721/diffusion-fundamentals.30.998. Disponível em: https://diffusion.publia.org/diffusion/article/view/998. Acesso em: 2 jun. 2025.